Engineering & Technical Guides
Engineering reference guides, technical checklists and practical explanations for preparing electronic manufacturing projects.
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Thermal Via Design for Power Components: Placement, Size and Solder-Wicking Risks
A practical guide to thermal-via placement, diameter, pitch, plane connection, filling and assembly trade-offs.
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Via-in-Pad, Filled and Capped Vias: What to Specify Before PCB Production
A practical guide to via-in-pad, filled and copper-capped vias, covering IPC-4761 terms, solder-wicking risks, fill materials and production-ready specifications.
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Controlled-Impedance PCB Stackups: What to Agree Before Layout
Agree impedance targets, trace structure, copper, dielectric data, reference planes, tolerances and coupon testing before PCB layout is frozen.