JEXPCB / Engineering knowledge
Knowledge Center
Clear answers for better builds. Practical guidance on PCB manufacturing, assembly, component sourcing and engineering decisions—from the first file review to production release.
Featured Articles
Start with these practical guides for your next PCB or PCBA project.
What Files Are Required for a PCB Assembly Quotation?
Prepare a consistent Gerber, BOM and placement package, define the assembly scope and learn how to start with incomplete files.
ENIG vs HASL: How to Choose the Right PCB Surface Finish
Compare planarity, assembly requirements, cost and lead-free specifications before choosing ENIG or HASL for a PCB.
Latest Articles
New technical guidance, automatically added when an article is published.
BGA and QFN Voiding: What X-Ray Results Actually Mean
How to interpret BGA and QFN X-ray voiding without relying on a misleading universal percentage, and how to define a production acceptance plan.
HDI Microvias: Stacked vs Staggered Vias and Sequential Lamination
A practical HDI guide to stacked and staggered microvias, sequential lamination, reliability trade-offs and production-release data.
Component Traceability: What Evidence Should Buyers Request?
What component traceability can and cannot prove, and which evidence buyers should request according to product risk.
IPC-A-600, IPC-6012 and IPC-A-610: What Does Each Standard Actually Cover?
A buyer-focused explanation of three frequently confused IPC documents and how to cite them correctly on PCB and PCBA orders.
Thermal Via Design for Power Components: Placement, Size and Solder-Wicking Risks
A practical guide to thermal-via placement, diameter, pitch, plane connection, filling and assembly trade-offs.
Why PCB Quotations Are Becoming More Time-Sensitive During Material Volatility
A buyer-focused guide to quote validity, material reservations, cost drivers and faster confirmation during volatile PCB material markets.
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